SONY, PANASONIC AND SAMSUNG TEAM UP WITH XPAND 3D TO TEST CROSS-COMPATIBILITY

One of the big, bad issues with 3D has been the variety of technologies used by different vendors. At this stage in the game, with the HDTV market delineated by price tier, most companies have determined to stick to one particular format of 3D technology.  On the lower end of the price spectrum, companies offering “budget” 3D HDTV’s, [...]

Best Practices ARIAN SEMICONDUCTOR EQUIPMENT